Display Device and Method for Fabricating the Same

ABSTRACT

An inexpensive display device, as well as an electrical apparatus employing the same, can be provided. In the display device in which a pixel section and a driver circuit are included on one and the same insulating surface, the driver circuit includes a decoder  100  and a buffer section  101.  The decoder  100  includes a plurality of NAND circuits each including p-channel TFTs  104  to  106  connected to each other in parallel and other p-channel TFTs  107  to  109  connected to each other in series. The buffer section  101  includes a plurality of buffers each including three p-channel TFTs  114  to  116.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a device having an element in which alight-emitting material is interposed between electrodes (hereinafter,such a device is referred to as the light-emitting device and such anelement is referred to as the light-emitting element). In particular,the present invention relates to a device including on one and the sameinsulating surface, a pixel section and a driver circuit fortransmitting a signal to the pixel section. In addition, the presentinvention can be used for a device having an element in which liquidcrystal is interposed between electrodes (hereinafter, such a device isreferred to as the liquid crystal display device and such an element isreferred to as the liquid crystal element). It should be noted that inthe present specification, the light-emitting device and the liquidcrystal display device are collectively referred to as the displaydevice.

Light-emitting materials that can be used in the present inventioninclude all of light-emitting materials that emit light (phosphorescentlight and/or fluorescent light) via singlet excitation or tripletexcitation, or both of these excitations.

2. Description of the Related Art

Recently, developments for a light-emitting device including alight-emitting element which utilizes a light-emitting material capableof providing EL (Electro Luminescence) has been progressed (hereinafter,such a light-emitting device is simply referred to as the light-emittingdevice; such a light-emitting element is referred to as the EL element;and such a light-emitting material is referred to as the EL material).The light-emitting device has a structure having an EL element in whicha thin film made of the EL material is interposed between an anode and acathode.

Although in the developments for the light-emitting devices thepassive-matrix type devices have been mainly focused. it has beenconsidered that there will exist disadvantages with the passive-matrixtype light-emitting devices in that a sufficient reliability (a longlifetime of the EL element) cannot be ensured with a higher precisionpixel section which requires the luminance of the EL element to beincreased. From the above circumstances, the active-matrix typelight-emitting devices are recently drawing much attention for thepurpose of realizing a higher precision display. The active-matrix typelight-emitting device is characterized in that an active element isprovided within each pixel so that the EL element is allowed to emitlight in accordance with an input signal. As the active element, a TFT(Thin Film Transistor) is commonly employed.

Reference is now made to FIG. 4, which illustrates a pixel structure ofthe active-matrix type light-emitting device. In FIG. 4, referencenumeral 401 denotes a source wiring, 402 denotes a gate wiring, 403denotes a TFT functioning as a switching element (hereinafter referredto as the switching TFT), and 404 denotes a capacitor electricallyconnected to a drain of the switching TFT 403.

The drain of the switching TFT 403 is also electrically connected to agate electrode of a current-controlling TFT 405. A source of thecurrent-controlling TFT 405 is electrically connected to a currentsupply line 406, while a drain thereof is electrically connected to anEL element 407. In other word, the current-controlling TFT 405 canfunction as an element for controlling current flowing through the ELelement 407.

The luminance of the EL element can be controlled by thus providing thetwo TFTs having different functions, respectively, in each of thepixels. As a result, a light-emitting period can substantiallycorrespond to one-frame period, and an image can be displayed whilesuppressing the luminance even with a higher precision pixel section.Furthermore, advantages of the active-matrix type device include thecapability of forming, as a driver circuit for transmitting a signal tothe pixel section, a shift register or a sampling circuit with TFTs onthe same substrate. This enables fabrication of a very compactlight-emitting device.

However, it is difficult to ensure a sufficient production yield of theactive-matrix type light-emitting device, as compared to thepassive-matrix type device that has a simpler structure, since aplurality of TFTs have to be formed on the same substrate in theactive-matrix type device. Particularly in the case where the drivercircuit is to he provided on the same substrate, a line defect may arisein which one line of the pixels does not operate because of a defect ofoperation. In addition, since fabrication steps for the TFTs arerelatively complicated, there is the higher possibility of increasing afabrication cost of the active-matrix type device, as compared to thatof the passive-matrix type device. In such a case, a disadvantage ofincreasing a price of an electrical apparatus employing theactive-matrix type light-emitting device in its display section mayarise.

Thus, the present invention is intended to reduce a fabrication cost ofthe active-matrix type display device so as to provide an inexpensivedisplay device. In addition, the present invention is also intended toprovide an inexpensive electrical apparatus that employs in its displaysection, the display device in accordance with the present invention.

SUMMARY OF THE INVENTION

In accordance with the present invention, in order to reduce afabrication cost of an active-matrix type display device, all of theTFIs to be used in a pixel section are provided as a TFT of oneconductivity type (indicating herein either a p-channel TFT or ann-channel TFT), and furthermore, a driver circuit is also formedentirely with TFTs of the same conductivity type as in the pixelsection. Thus, a fabrication process can be significantly reduced, andtherefore, the fabrication cost can be reduced.

For the above purpose, in accordance with one aspect of the presentinvention, all of a source wiring, a gate electrode, a gate wiring(which is a line that transmits a signal to the gate electrode), and acurrent supply line are simultaneously formed. In other word, anidentical electrically conductive (hereinafter simply referred to as“conductive”) film is formed on the same surface. In addition, inaccordance with another aspect of the present invention, a line(referred to as the connecting wiring in the present specification) thatconnects the TFT to a line for connecting a plurality of independentlyformed gate wirings to each other, or the source wiring, or the currentsupply line, is formed on the same surface with the identical conductivefilm as the drain wiring of the current-controlling TFT.

Furthermore, in accordance with a further important aspect of thepresent invention, a driver circuit is formed of TFTs of one and thesame conductivity type. In other word, in contrast to the conventionaldriver circuit that is in general designed based on a CMOS circuit inwhich an n-channel TFT and a p-channel TFT are complimentarily combinedto each other, the driver circuit in accordance with the presentinvention is formed by combining only the p-channel TFTs or then-channel TFTs.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIG. 1 shows a structure of a gate-side driver circuit;

FIG. 2 shows a timing chart of decoder input signals;

FIG. 3 shows a structure of a source-side driver circuit;

FIG. 4 shows a circuit structure of a pixel section of a light-emittingdevice;

FIG. 5 shows a cross-sectional structure of the pixel section of thelight-emitting device;

FIG. 6 shows a top-view structure of the pixel section of thelight-emitting device;

FIGS. 7(A) and 7(B) each show another cross-sectional structure of thepixel section of the light-emitting device;

FIGS. 8(A) through 8(D) show various fabrication steps of thelight-emitting device;

FIGS. 9(A) through 9(C) show various fabrication steps of thelight-emitting device;

FIG. 10 shows another circuit structure of a pixel section of alight-emitting device;

FIG. 11 shows yet another circuit structure of a pixel section of alight-emitting device;

FIGS. 12(A) through 12(C) show various fabrication steps of thelight-emitting device;

FIG. 13 shows another top-view structure of the pixel section of thelight-emitting device;

FIGS. 14(A) through 14(C) show various fabrication steps of thelight-emitting device;

FIG. 15(A) shows yet another top-view structure of the pixel section ofthe light-emitting device;

FIG. 15(B) shows yet another cross-sectional structure of the pixelsection of the light-emitting device;

FIGS. 16(A) and 16(B) show yet other circuit structures of a pixelsection of a light-emitting device;

FIGS. 17(A) and 17(B) show yet other circuit structures of a pixelsection of a light-emitting device;

FIG. 18 shows a thin film forming apparatus for forming an EL layer;

FIGS. 19(A) and 19(B) show external appearances of a liquid crystaldisplay device;

FIGS. 20(A) through 20(F) show specific examples of an electricalapparatus, respectively; and

FIGS. 21(A) through 21(D) show specific examples of an electricalapparatus, respectively;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

With now reference to FIGS. 1 and 2, a driver circuit to be used in thepresent invention will be described. In accordance with the presentinvention, instead of a typical shift register, a decoder employingp-channel TFTs as shown in FIG. 1 is used. FIG. 1 illustrates an exampleof a gate-side driver circuit.

In FIG. 1, reference numeral 100 denotes a decoder in the gate-sidedriver circuit, and 101 denotes a buffer section of the gate-side drivercircuit. Here, the buffer section refers to a section in which aplurality of buffers (buffer amplifiers) are integrated. Furthermore,the buffer refers to a circuit capable of exhibiting the drivingcapability without providing any adverse effects of a subsequent stageon a previous stage.

The gate-side decoder 100 will be now described. Reference numeral 102denotes input signal lines (hereinafter referred to as the selectionlines) of the decoder 100, and more specifically indicates A1, A1 bar (asignal having an inverted polarity with respect to A1), A2, A2 bar (asignal having an inverted polarity with respect to A2), . . . , An, andAn bar (a signal having an inverted polarity with respect to An). Inother word, it can be considered that the 2 n selection lines arearranged.

The number of the selection lines is determined based on the number ofgate wirings to be output from the gate-side driver circuit. Forexample, in the case where a pixel section for VGA display is provided,480 gate wirings are required, which in turn requires a total of 18selection lines to be provided for 9 bits (corresponding to the casewhere n=9). The selection lines 102 transmit signals shown in the timingchart in FIG. 2. As shown in FIG. 2, assuming that a frequency of A1 isnormalized to be 1, a frequency of A2 can be expressed as 2⁻¹, afrequency of A3 can be expressed as 2⁻², and a frequency of An can beexpressed as 2^(−(n−1)).

Reference numeral 103 a denotes a first-stage NAND circuit (alsoreferred to as the NAND cell), while 103 b and 103 c denote asecond-stage and an n-th stage NAND circuits, respectively. The requirednumber of the NAND circuits is equal to the number of the gate wirings,and specifically, n NAND circuits are required here. In other word, thedecoder 100 in accordance with the present invention is composed of aplurality of the NAND circuits.

In each of the NAND circuits 103 a to 103 c, p-channel TFTs 104 to 109are combined to form a NAND circuit. Actually, 2 n TFTs are employed ineach of the NAND circuits 103. Furthermore, a gate of each of thep-channel TFTs 104 to 109 is connected to either one of the selectionlines 102 (A1, A1 bar, A2, A2 bar, . . . , An, An bar).

In this case, in the NAND circuit 103 a, the p-channel TFTs 104 to 106that respectively have the gates connected to any of A1, A2, . . . , An(which are referred to as the positive selection lines) are connected toeach other in parallel, and further connected to a positive power sourcewiring (V_(DH)) 110 as a common source, as well as to an output line 111as a common drain. On the other hand, the remaining p-channel TFTs 107to 109 that respectively have the gates connected to any of A1 bar, A2bar, . . . , An bar (which are referred to as the negative selectionlines) are connected to each other in series, and a source of thep-channel TFT 109 positioned at one end of the circuit is connected to anegative power source wiring (V_(DL)) 112 while a drain of the p-channelTFT 107 positioned at the other end of the circuit is connected to theoutput line 111.

As described in the above, the NAND circuit in accordance with thepresent invention includes the n TFTs of one conductivity type (thep-channel TFTs in this case) connected in series and the other n TFTs ofthe one conductivity type (the p-channel TFTs in this case) connected inparallel. It should be noted that in the n NAND circuits 103 a to 103 c,all of combinations among the p-channel TFTs and the selection lines aredifferent from each other. In other word, the output lines 111 areconfigured so that only one of them is selected, and signals are inputto the selection lines such that the output lines 111 are sequentiallyselected from one side thereof.

Then, the buffer 101 is composed of a plurality of buffers 113 a to 113c so as to respectively correspond to the NAND circuits 103 a to 103 c.It should be noted that the buffers 113 a to 113 c may have the samestructure.

Furthermore, the buffers 113 a to 113 c are formed with p-channel TFTs114 to 116 as TFTs of one conductivity type. The output line 111 fromthe decoder is input as a gate of the corresponding p-channel TFT 114 (afirst TFT of the one conductivity type). The p-channel TFT 114 utilizesa ground power source wiring (GND) 117 as its source, and a gate wiring118 as its drain. Moreover, the p-channel TFT 115 (a second TFT of theone conductivity type) utilizes the ground power source line 117 as itsgate, a positive power source line (V_(DH)) 119 as its source, and thegate wiring 118 as its drain. The p-channel TFT 115 is always in the ONstate.

In other words, each of the buffers 113 a to 113 c in accordance withthe present invention includes the first TFT of the one conductivitytype (the p-channel TFT 114), and further includes the second TFT of theone conductivity type (the p-channel TFT 115) that is connected to thefirst TFT of the one conductivity type in series and utilizes the gateof the first TFT of the one conductivity type as the drain.

Furthermore, the p-channel TFT 116 (a third TFT of the one conductivitytype) employs a reset signal line (Reset) as its gate, the positivepower source line 119 as its source, and the gate wiring 118 as itsdrain. It should be noted that the ground power source line 117 may bereplaced with a negative power source line (which is a power source linefor providing a voltage that causes a p-channel TFT, to be used as aswitching element of a pixel, to be in the ON state).

In this case, a channel width (indicated as W1) of the p-channel TFT 115and a channel width (indicated as W2) of the p-channel TFT 114 satisfythe relationship of W1<W2. The channel width refers to a length of achannel formation region measured in the direction perpendicular to achannel length.

The buffer 113 a operates as follows. During a time period in which apositive voltage is being applied to the output line 111, the p-channelTFT 114 is in the OFF state (i.e., its channel is not formed). On theother hand, since the p-channel TFT 115 is always in the ON state (i.e.,its channel is formed), a voltage of the positive power source line 119is applied to the gate wiring 118.

On the other hand, in the case where a negative voltage is applied tothe output line 111, the p-channel TFT 114 comes into the ON state. Inthis case, since the channel width of the p-channel TFT 114 is widerthan that of the p-channel TFT 115, the electrical potential of the gatewiring 118 is pulled by an output on the side of the p-channel TFT 114,thereby resulting in the electrical potential of the ground power sourceline 117 being applied to the gate wiring 118.

Accordingly, the gate wiring 118 outputs a negative voltage (that causesthe p-channel TFT, to be used as the switching element of the pixel, tobe in the ON state) when a negative voltage is being applied onto theoutput line 111, while always outputting a positive voltage (that causesthe p-channel TFT, to be used as the switching element of the pixel, tobe in the OFF state) when a positive voltage is being applied onto theoutput line 111.

The p-channel TFT 116 is used as a reset switch for forcing the gatewiring 118, to which the negative voltage is being applied, to be pulledup to a positive voltage. Namely, after a selection period of the gatewiring 118 is completed, a reset signal is input so that a positivevoltage is applied to the gate wiring 118. It should be noted that thep-channel TFT 116 maybe omitted.

With the gate-side driver circuit that operates in the above-describedmanner, the gate wirings are sequentially selected. Then, the structureof a source-side driver circuit is shown in FIG. 3. The source-sidedriver circuit as shown in FIG. 3 includes a decoder 301, a latch 302,and a buffer 303. Since the decoder 301 and the buffer 303 have theidentical structures with those of the gate-side driver circuit,respectively, descriptions therefor are omitted here.

In the case of the source-side driver circuit shown in FIG. 3, the latch302 is composed of a first-stage latch 304 and a second-stage latch 305.Each of the first-stage latch 304 and the second-stage latch 305includes a plurality of basic units 307 each composed of m p-channelTFTs 306 a to 306 c. An output line 308 from the decoder 301 is input togates of the respective m p-channel TFTs 306 a to 306 c that form thebasic unit 307. It should be noted that the number m is any integer.

For example, in the case of the VGA display, the number of the sourcewirings is 640. In the case where m=1, the number of the NAND circuitsrequired to be provided is also 640, while 20 selection lines(corresponding to 10 bits) are required to be provided. On the otherhand, however, when m=8, the number of the necessary NAND circuits is 80and the number of the necessary selection lines is 14 (corresponding to7 bits). Namely, assuming that the number of the source wirings is M,the number of necessary NAND circuits can be expressed as M/m.

Sources of the p-channel TFTs 306 a to 306 c are connected to videosignal lines (V1, V2, . . . , Vk) 309, respectively. Namely, when anegative voltage is applied to an output line 308, all of the p-channelTFTs 306 a to 306 c are simultaneously put into the ON state, so thatvideo signals are taken into the corresponding p-channel TFTs 306 a to306 c, respectively. The video signals thus taken in are retained incapacitors 310 a to 310 c, respectively, connected thereto.

Furthermore, the second-stage latch 305 also includes a plurality ofbasic units 307 b each composed of m p-channel TFTs 311 a to 311 c. Allof gates of the p-channel TFTs 311 a to 311 c are connected to a latchsignal line 312, so that when a negative voltage is applied to the latchsignal line 312, all of the p-channel TFTs 311 a to 311 c aresimultaneously turned on.

As a result, the signals retained in the capacitors 310 a to 310 c arethen retained respectively in capacitors 313 a to 313 c connected to thep-channel TFTs 311 a to 311 c and simultaneously output to the buffer303. Then, as described with reference to FIG. 1, those signals areoutput to the source wirings 314 via the buffer. With the source-sidedriver circuit that operates in the above-described manner, the sourcewirings are sequentially selected.

As described in the above, by composing the gate-side driver circuit andthe source-side driver circuit only of the p-channel TFTs, all of thepixel sections and the driver circuits can be entirely formed of thep-channel TFTs. Accordingly, upon fabrication of an active-matrix typedisplay device, a fabrication yield and a throughput of the TFT stepscan be significantly improved, thereby resulting in a reducedfabrication cost.

It should be noted that the present invention can be embodied even inthe case where either of the source-side driver circuit or the gate-sidedriver circuit, or both of them, are provided in an IC chip to beexternally attached.

Embodiment 1

In the present invention, the pixel section, in addition to the drivercircuit, is entirely composed of the p-channel TFTs. Thus, in thepresent embodiment, the structure of the pixel section for displaying animage in accordance with the signals transmitted by the driver circuitas shown in FIGS. 1 and 3 will be described.

The structure of a pixel of an active-matrix type light-emitting devicein accordance with the present invention is shown in FIGS. 5 and 6. FIG.5 illustrates a cross-sectional view of one pixel, while FIG. 6illustrates a top view of adjacent two pixels. FIG. 5 shows across-sectional view cut along A-A′ in FIG. 6, and the same component isdesignated with the same reference numeral in both of these figures. Inaddition, the two pixels illustrated in FIG. 6 are symmetric to eachother with respect to the current supply line 525, and therefore, havethe same structure as each other.

In FIG. 5, reference numeral 501 denotes a substrate transparent tovisible light, and 502 denotes an insulating film containing silicon. Asthe substrate 501 that is transparent to visible light, a glasssubstrate, a quartz substrate, a crystalline glass substrate, or aplastic substrate (including a plastic film) can be used. As theinsulating film 502 containing silicon, a silicon oxide film, a siliconoxynitride film, or a silicon nitride film can be used.

In the present specification, TFTs are formed on an insulating surface.As the insulating surface, an insulating film (typically an insulatingfilm containing silicon) or a substrate made of an insulating body(typically a quartz substrate) may be used. Accordingly, the expression“on the insulating surface” means “on the insulating film” or “on thesubstrate made of the insulating material”.

On the insulating film 502 containing silicon, a switching TFT 601 and acurrent-controlling TFT 602 are formed with p-channel TFTs.

The switching TFT 601 employs, as an active layer, a semiconductorregion that includes regions 503 to 505 made of p-type semiconductor(hereinafter referred to as the p-type semiconductor regions) andregions 506 and 507 made of intrinsic or substantially intrinsicsemiconductor (hereinafter referred to as the channel formationregions). On the other hand, the current-controlling TFT 602 employs, asan active layer, a semiconductor region including p-type semiconductorregions 508 and 509 and a channel formation region 510.

The p-type semiconductor region 503 or 505 serves as a source region ora drain region of the switching TFT 601. Furthermore, the p-typesemiconductor region 508 serves as a source region of thecurrent-controlling TFT 602, while the p-type semiconductor region 509serves as a drain region of the current-controlling TFT 602.

The active layers of the switching TFT 601 and the current-controllingTFT 602 are covered with a gate insulating film 511, and furtherthereon, a source wiring 512, a gate electrode 513 a, a gate electrode513 b, a drain wiring 514, and a gate electrode 515 are formed. Thesecomponents are simultaneously formed with the identical material. As theconstituent material for these lines or electrodes, tantalum, tungsten,molybdenum, niobium, titanium, or a nitride of these metals may be used.Alternatively, an alloy in which these metals are combined, or asilicide of these metals, may be used.

Furthermore, as shown in FIG. 6, the drain wiring 514 is integrated withthe gate electrode 515. In addition, the gate electrodes 513 a and 513 bare integrated with the shared gate wiring 516, so that the same voltageis always being applied to these gate electrodes 513 a and 513 b.

Moreover, in FIG. 5, reference numeral 517 denotes a passivation filmmade of a silicon oxynitride film or a silicon nitride film, and aninterlayer insulating film 518 is formed thereon. As the interlayerinsulating film 518, an insulating film containing silicon or an organicresin film is used. As the organic resin film, a polyimide film, apolyamide film, an acrylic resin film, or a BCB (benzocyclobutene) filmcan be used.

Further on the interlayer insulating film 518, connecting wirings 519 to522 and an electrode 523 made of a transparent conductive film areformed. At the same time, line 524 as shown in FIG. 6 are alsosimultaneously formed. As the transparent conductive film, a thin filmmade of indium oxide, tin oxide, zinc oxide, a compound of indium oxideand tin oxide, a compound of indium oxide and zinc oxide, or a compoundobtainable by adding gallium to these materials can be used.

In this case, the connecting wiring 520 is a line that provideselectrical connection between the source wiring 512 and the p-typesemiconductor region 503, while the connecting wiring 521 is a line thatprovides electrical connection between the p-type semiconductor region505 and the drain region 514. Moreover, the connecting wiring 522 is aline that provides electrical connection between the source region 508and the current supply line (see FIG. 6) 525.

The connecting wiring 519 is a line that realizes connections among thegate wirings 516 divided and formed into a plurality of patterns, and isprovided to overpass the source wiring 512 and the current supply line525. It is also possible to connect the source wiring or the currentsupply line, divided into a plurality of portions, with the connectingwiring formed so as to overpass the gate wiring.

An electrode 523 is an anode of the EL element, and is referred to asthe pixel electrode or the anode in the present specification. The pixelelectrode 523 is electrically connected to a drain region 509 of thecurrent-controlling TFT 602. In FIG. 6, the pixel electrode 523 can beconsidered as a drain wiring of the current-controlling TFT 602.

FIG. 7(A) shows a cross-sectional view obtainable by cutting FIG. 6along B-B′. As shown in FIG. 7(A), the connecting wiring 524 overpassesthe current supply line 525 and provides connection among the gatewirings 516. In addition, FIG. 7(B) shows a cross-sectional viewobtainable by cutting FIG. 6 along C-C′. As shown in FIG. 7(B), theconnecting wiring 522 electrically connects the p-type semiconductorregion 508 of the current-controlling TFT 602 with the current supplyline 525.

In the actual device, an EL layer (not shown) and a cathode (not shown)are formed thereafter on the pixel electrode 523 to complete anactive-matrix type light-emitting device. The EL layer and the cathodemay be formed with any known technique.

Furthermore, although a TFT having a top-gate structure (specifically, aplanar-type TFT) has been described as an example in the above, thepresent invention is not limited to such a kind of TFT structure.Alternatively, the present invention can be applied to a TFT having abottom-gate structure. Typically, it is possible to embody the presentinvention in a reverse-staggered type TFT.

With the pixel structure as described in the above, the fabricationprocess for the active-matrix type light-emitting device can besignificantly simplified, and an inexpensive active-matrix typelight-emitting device can be produced. In addition, an electricalapparatus that employs the same as a display section can be realized.

Embodiment 2

In the present embodiment, the fabrication process of an active-matrixtype light-emitting device in which a pixel section and a driver circuitfor transmitting a signal to the pixel section are formed on theidentical insulating surface will be described with reference to FIGS.8(A) to 8(D) and FIGS. 9(A) to 9(C).

First, as shown in FIG. 8(A), an underlying film (insulating body) 802is formed on a glass substrate 801. In the present embodiment, theunderlying film 802 is formed by sequentially depositing a first siliconoxynitride film having a thickness of 50 nm and a second siliconoxynitride film having a thickness of 200 nm in this order from the sidecloser to the glass substrate 801. The nitrogen content of the firstsilicon oxynitride film is larger than that of the second siliconoxynitride film so as to suppress diffusion of alkali metal from theglass substrate 801.

Then, an amorphous silicon film (not shown) is formed on the underlyingfilm 802 by a plasma CVD method to have a thickness of 40 nm.Thereafter, the amorphous silicon film is irradiated with laser lightfor crystallization to form a polycrystalline silicon film (polysiliconfilm) 803. It should be noted that a microcrystalline silicon film or anamorphous silicon germanium film may be formed instead of the amorphoussilicon film. Moreover, a method for crystallization is not limited tothe laser crystallization method, but any other known crystallizationmethod can be used.

Then, as shown in FIG. 8(B), the polycrystalline silicon film 803 ispatterned to form respective independently isolated semiconductor layers804 to 806. Upon completion, the semiconductor layer denoted withreference numeral 804 becomes an active layer of a TFT that forms adriver circuit (this TFT is referred to as driver TFT). On the otherhand, the semiconductor layer denoted with reference numeral 805 becomesan active layer of the switching TFT, while that denoted with referencenumeral 806 denotes an active layer of the current-controlling TFT.

Thereafter, a gate insulating film 807 with a thickness of 80 nm, madeof a silicon oxide film, is formed by a plasma CVD method so as to coverthe isolated semiconductor layers 804 to 806. Furthermore, a tungstenfilm (not shown) is formed by a sputtering method on the gate insulatingfilm 807 to have a thickness of 350 nm, and is then patterned to formgate electrodes 808, 809, 810 a, and 810 b. Simultaneously, a sourcewiring 812 and a drain wiring 813 of the switching TFT are formed. Ofcourse, the drain wiring 813 and the gate electrode 811 are formedintegrally.

Then, elements belonging to Group 13 in the periodic table are addedwith the gate electrodes 808, 809, 810 a, 810 b, the source wiring 812and the drain wiring 813 being used as a mask. Any known methods may beused for the above purpose. In the present embodiment, boron is added bya plasma doping method at the concentration in the range of 5×10¹⁹ to1×10²¹ atoms/cm³. Thus, the semiconductor regions with the p-typeconductivity (hereinafter referred to as the p-type semiconductorregions) 814 to 821 are formed. Furthermore, channel formation regions822 to 826 are formed immediately below the gate electrodes 808, 809,810 a, and 810 b.

It should be noted that in the present embodiment, the p-typesemiconductor regions 814 and 816 serve as source regions of thep-channel TFTs forming the driver circuit, while the p-typesemiconductor region 815 serves as a drain region of the p-channel TFTforming the driver circuit.

Thereafter, a heat treatment is performed to activate the elements inthe Group 13 of the periodic table contained in the p-type semiconductorregions. This activation process may be performed by either one of afurnace annealing method, a laser annealing method, and a lamp annealingmethod, or any combination thereof. In the present embodiment, a heattreatment is performed at 500° C. for four (4) hours in nitrogenatmosphere. In this case, it is preferable to reduce the concentrationof oxygen in the nitrogen atmosphere to as low a level as possible. Theactive layers of the TFTs are formed by the above activation process.

After the activation process is completed, a silicon oxynitride filmwith a thickness of 200 nm is formed as a passivation film 827, and ahydrogenation process for the semiconductor layers is then performed.Any known hydrogen annealing technique or a plasma hydrogenationtechnique may be used for the hydrogenation process. Thus, the structureas shown in FIG. 8(C) can be obtained.

Thereafter, as shown in FIG. 8(D), an interlayer insulating film 828made of a resin is formed to have a thickness of 800 nm. As the resinfor this purpose, polyimide, polyamide, acrylic resin, epoxy resin, orBCB (benzocyclobutene) may be used. Alternatively, an inorganicinsulating film may be also used.

Contact holes are then formed in the interlayer insulating film 828, andconnecting wirings 829 to 835 and a pixel electrode 836 are formed. Inthe present embodiment, a conductive film made of a compound of indiumoxide and tin oxide (Indium Tin Oxide; ITO) is used for forming theconnecting wirings 829 to 835 and the pixel electrode 836. It should benoted that of course, any conductive films made of other materials thatare transparent to visible light can be used for this purpose.

The connecting wirings 829 and 831 serve as source wirings of thep-channel TFTs forming the driver circuit, while the connecting wiring830 serves as a drain wiring of the p-channel TFT forming the drivercircuit. Thus, in the present embodiment, the driver circuit is formedbased on a PMOS circuit which is formed of p-channel TFTs.

In the above-described state, the p-channel TFTs forming the drivercircuit as well as the switching TFT and the current-controlling TFT inthe pixel section are completed. In the present embodiment, all of theTFTs are of the p-channel type. It should be noted that the switchingTFT is formed such that the gate electrode thereof overpasses the activelayer at two different positions so that the two channel formationregions are connected to each other in series. Such a structure caneffectively suppress an OFF current value (i.e., a current that flowswhen a TFT is in the OFF state).

Then, as shown in FIG. 9(A), insulating bodies 837 and 838 made of aresin are formed so as to cover edge portions and concave portions(recesses formed due to the contact holes) of the pixel electrode 836.These insulating bodies 837 and 838 may be formed by forming aninsulating film made of a resin and then patterning the film. In thiscase, it is desirable to set a height (d) from the surface of the pixelelectrode 836 to the top of the insulating body 838 to be at 300 nm orless (preferably 200 nm or less). It should be noted that the insulatingbodies 837 and 838 may be omitted.

The insulating body 837 is formed for the purpose of covering the edgeportions of the pixel electrode 836 and thereby avoiding an adverseeffect of electric field concentration at the edge portions. Thus,deterioration of the EL layer can be prevented. On the other hand, theinsulating body 838 is formed for the purpose of burying the concaveportions of the pixel electrode which are formed due to the contactholes. Thus, any coverage defect of the EL layer to be later formed canbe prevented, and any short-circuit between the pixel electrode and acathode to be later formed can be prevented.

Thereafter, an EL layer 839 with a thickness of 70 nm and a cathode 840with a thickness of 300 nm are formed by a vapor deposition method. Inthe structure of the present embodiment, a copper phthalocyanine layer(hole injection layer) with a thickness of 20 nm and an Alg₃ layer(light-emitting layer) with a thickness of 50 nm are formed as the ELlayer 839. It should be noted that any other known structure in which ahole injection layer, a hole transport layer, an electron transportlayer or an electron injection layer are combined may be used for thelight-emitting layer.

In the present embodiment, the copper phthalocyanine layer is firstformed to cover all of the pixel electrodes, and thereafter, a red-colorlight-emitting layer, a green-color light-emitting layer, or ablue-color light-emitting layer are formed for each of the pixelscorresponding to red, green and blue colors, respectively. The regionsto which the layer is to be formed may be selected upon vapor depositionby means of a shadow mask. Thus, a color display can be realized.

When the green-color light-emitting layer is to be formed, Alq₃(tris-8-quinolinolato aluminum complex) is used as a mother material ofthe light-emitting layer, and quinacridon or coumarine 6 is used as adopant. When the red-color light-emitting layer is to be formed, Alq₃ isused as a mother material of the light-emitting layer, and DCJT, DCM1,or DCM2 is used as a dopant. When the blue-color light-emitting layer isto be formed, BAlq₃ (a complex with five coordinations having a mixedligand of 2-methyl-8-quinolinol and phenol derivative) is used as amother material of the light-emitting layer, and perylene is used as adopant.

It should be noted that the present invention is not limited to use ofthe above-mentioned organic materials, but rather, any knownlow-molecule type organic EL material, high-molecule type organic ELmaterial, or inorganic EL material can be used. Alternatively, anycombination of these materials can be also used. Furthermore, in thecase where a high-molecule type organic EL material is used, a coatingmethod can be used.

In the manner as mentioned in the above, the EL element composed ofpixel electrode (anode) 836, EL layer 839 and cathode 840 is formed (seeFIG. 9(B)).

Thereafter, a cover member 842 is bonded by means of an adhesive 841. Inthe present embodiment, a glass substrate is used as the cover member842. Alternatively, a flexible plastic film, a quartz substrate, aplastic substrate, a metal substrate, a silicon substrate, or a ceramicsubstrate may be used. It is advantageous to provide an insulating filmcontaining silicon or a carbon film on a surface exposed to thesurrounding air so as to prevent oxygen or water from entering or toprovide protection against scratches caused by friction.

As the adhesive 841, a UV curable resin or a thermosetting resin istypically used. For example, PVC (polyvinyl chloride), acrylic resin,polyimide, epoxy resin, silicone resin, PVB (polyvinyl butyral), or EVA(ethylene vinyl acetate) can be used. In the case where the adhesive 841is positioned in the side closer to an observer when viewed from the ELelement, the adhesive is required to be made of a material that allowslight to pass therethrough. In addition, it is advantageous to provide awater-absorbing material (preferably barium oxide) and/or ananti-oxidization material (i.e., a substance that adsorbs oxygen) withinthe adhesive 841 for preventing deterioration of the EL element.

With the above-described structure, the EL element can be completelyshut out from the ambient air. Thus, deterioration of the EL materialdue to oxidation can be substantially completely suppressed, so thatreliability of the resultant EL element can be significantly improved.

The active-matrix type light-emitting device thus fabricated in theabove-described manner has the pixel section that includes the circuitstructure as shown in FIG. 10. Specifically, in FIG. 10, referencenumeral 1001 denotes a source wiring, 1002 denotes a gate wiring, 1003denotes a switching TFT, 1004 denotes a current-controlling TFT, 1005denotes a current supply line, and 1006 denotes an EL element. In thepresent embodiment, each of the switching TFT 1003 and thecurrent-controlling TFT 1004 is formed as the p-channel TFT.

It should be noted that a gate capacitance of the current-controllingTFT 1004 exhibits the same function as the capacitor employed in theconventional art (i.e., the capacitor 404 in FIG. 4). This can berealized because in the case where a time-divisional grayscale displayis performed by means of a digital driving scheme, necessary charges canbe retained only by the gate capacitance of the current-controlling TFTsince one-frame period (or one-field period) is short.

The active-matrix type light-emitting device of the present invention asdescribed in the above requires only five masks in total for performingthe patterning steps (this number can be further reduced to four whenthe insulating bodies 837 and 838 are omitted), which can in turnrealize a high fabrication yield and a low fabrication cost.

Embodiment 3

In Embodiment 2 mentioned in the above, the circuit structure of thepixel section shown in FIG. 10 can be modified as shown in FIG. 11.Specifically, in FIG. 11, reference numeral 1101 denotes a sourcewiring, 1102 denotes a gate wiring, 1103 denotes a switching TFT, 1104denotes a current-controlling TFT, 1105 denotes a current supply line,and 1106 denotes an EL element. In the present embodiment, each of theswitching TFT 1103 and the current-controlling TFT 1104 is formed as thep-channel TFT.

In this case, since the gate wiring 1102 and the current supply line1105 are disposed in different layers, it is advantageous to providethese components so as to overlap each other with an interlayerinsulating film interposed therebetween. Thus, an occupied area of theselines can be substantially made common, and therefore, the effectivelight-emission area of the pixel can be increased.

Embodiment 4

In the present embodiment, the active-matrix type light-emitting deviceis fabricated in the manner different from that described inEmbodiment 1. The fabrication process will be described below withreference to FIGS. 12(A) to 12(C).

First, the fabrication steps up to the one as shown in FIG. 8(D) areperformed as described previously in connection with Embodiment 2 toform connecting wirings 1201 to 1207 and a drain wiring 1208. In thepresent embodiment, these connecting wirings are formed of a metal film.Although any material can be used as the metal film, a layered filmhaving a three-layer structure in which an aluminum film is sandwichedbetween titanium films is employed in the present embodiment.

Then, as shown in FIG. 12(B), a pixel electrode 1209 made of atransparent conductive film is formed. In this case, the pixel electrode1209 is formed such that a portion thereof comes into contact with thedrain wiring 1208. The current-controlling TFT and the pixel electrodecan be thus electrically connected to each other. FIG. 13 shows a topview in the above-described structure. It should be noted that thecross-sectional view shown in FIG. 12(B) is obtainable by cutting FIG.13 along A-A′.

In the present embodiment, the connecting wirings 1201 to 1207 can bemade of a metal film. Accordingly, as compared to the transparentconducting film such as an ITO film or the like described in theprevious embodiment modes, a reduction in a wiring resistance as well asa reduction in a contact resistance can be realized. Moreover, all ofthe lines for connecting various circuit portions in the driver circuitcan be made of a low-resistance metal film, and therefore, a drivercircuit capable of exhibiting a higher operating speed can be realized.

Although the pixel electrode 1209 is formed after the connecting wirings1201 to 1207 and the drain wiring 1208 are completed, this fabricationorder may be reversed. In other word, the connecting wirings and thedrain wiring made of a metal film may be formed after the pixelelectrode made of a transparent conductive film is formed.

Thereafter, as in Embodiment 2, an insulating body 1210 made of a resinis formed, and an EL layer 1211 and a cathode 1212 are sequentiallyformed. Furthermore, a cover member 1214 is formed with an adhesive1213. Thus, the active-matrix type light-emitting device as shown inFIG. 12(C) is completed.

Embodiment 5

In the present embodiment, an example of fabricating the active-matrixtype light-emitting device in accordance with the present invention witha plastic substrate or a plastic film will be explained. Plastics thatcan be used in the present embodiment include PES (polyethylenesulfile), PC (polycarbonate), PET (polyethylene terephthalate), or PEN(polyethylene naphthalate).

First, the TFTs and the EL element are formed on the glass substrate 801in accordance with the fabrication steps as described in Embodiment 2.In the present embodiment, however, a peeling layer 1401 is formedbetween the glass substrate 801 and the underlying film 802. Asemiconductor film can be used as the peeling layer 1401. Typically, anamorphous silicon film may be used for the above purpose.

Moreover, in the present embodiment, a cover member 1403 is adhered bymeans of a first adhesive 1402. An insulating film made of a resin(typically, polyimide, acrylic resin, polyamide, or epoxy resin) is usedas the first adhesive 1402. It should be noted that the material for thefirst adhesive 1402 is required to realize a sufficient selection ratioupon etching of the peeling layer 1401 by means of a gas containinghalogen fluoride. As the cover member 1403 to be adhered with the firstadhesive 1402, a PET film is used in the present embodiment.

Then, the entire substrate on which the element has been formed isexposed to the gas containing halogen fluoride. This treatment allowsthe peeling layer 1401 to be selectively removed. Halogen fluoriderefers to a substance that can be expressed as the chemical formula ofXFn (where X indicates a halogen other than fluorine, and n is aninteger). For example, as the halogen fluoride, chlorine monofluoride(ClF), chlorine trifluoride (ClF₃), bromine monofluoride (BrF), brominetrifluoride (BrF₃), iodine monofluoride (IF), iodine trifluoride (IF₃)can be used.

Halogen fluoride exhibits a large selection ratio between a silicon filmand a silicon oxide film, thereby resulting in a selective etching ofthe silicon film being realized. Furthermore, this etching reaction caneasily proceed at room temperature, and therefore, the process can beperformed even after the EL element with low heat-resistance capabilityis formed.

Although the silicon film can be etched only by being exposed to theabove-mentioned halogen fluoride, other fluorides (carbon tetrafluoride(CF₄) or nitrogen trifluoride) may be used in the present invention solong as they are put into a plasma condition.

In the present embodiment, chlorine trifluoride (ClF₃) is used ashalogen fluoride and nitrogen is used for a dilution gas. Argon, helium,or neon may be used as the dilution gas. Flow rates of both of the gasesmay be set at 500 sccm (8.35×10⁻⁶ m³/s), and a reaction pressure may beset in the range from 1 to 10 Torr (1.3×10² to 1.3×10³ Pa). Moreover, atreatment temperature may be set at room temperature (typically in therange from 20 to 27° C.).

Thereafter, as shown in FIG. 14(C), a substrate (bonding substrate) 1405made of a plastic substrate or a plastic resin is adhered by means of asecond adhesive 1404. In the present embodiment, a PET film is used asthe bonding substrate 1405. It is desirable for the cover member 1403and the bonding substrate 1405 to be made of the same material as eachother in order to satisfy a stress balance condition.

Thus, the active-matrix type light-emitting device in which the TFTs andthe EL element are sandwiched by the plastic film can be obtained. Sincethe plastic film is bonded after the TFTs are formed in the presentembodiment, no limitation is applied onto the fabrication process. Forexample, the TFTs can be formed without taking the heat-resistancecapability of the plastic to be employed into consideration.

Furthermore, since a flexible, light-weighted light-emitting device canbe obtained, the device in the present embodiment is suitable to adisplay section of portable information equipment such as a mobilephone, an electronic databook or the like.

The structure as described in the present embodiment can be freelycombined with any structures in Embodiments 1 through 4.

Embodiment 6

In the present invention, it is advantageous to provide a DLC(diamond-like carbon) film on one side or both sides of the substrate orthe cover member on which the TFTs and the EL element are to be formed.It should be noted that a thickness of such a DLC film is desirably notgreater than 50 nm (more preferably in the range of 10 to 20 nm) sincetoo large a thickness thereof causes transmittance of the film to bereduced. In addition, the DLC film may be formed by a sputtering methodor an ECR plasma CVD method.

The DLC film is characterized by the Raman spectrum distributionincluding an asymmetric peak at around 1550 cm⁻¹, and a shoulder ataround 1300 cm⁻. Moreover, the DLC film is also characterized by thehardness in the range of 15 to 25 Pa when measured by means of amicro-hardness tester. Furthermore, it is advantageous to provide theDLC film as a protection film for surface protection and/or heatdissipation since the DLC film has a larger hardness and a larger heatconductivity as compared to the substrate or the cover member.

The structure as described in the present embodiment can be freelycombined with any structures in Embodiments 1 through 5.

Embodiment 7

In the present embodiment, external appearance views of thelight-emitting device of the present invention as described inEmbodiment 2 will be described. FIG. 15(A) shows a top view of thelight-emitting device of the present invention, while FIG. 15(B) shows across-sectional view thereof.

In FIG. 15(A), reference numeral 1501 denotes a substrate, 1502 denotesa pixel section, 1503 denotes a source-side driver circuit, and 1504denotes a gate-side driver circuit. Each of these driver circuits isconnected via a wiring 1505 to an FPC (flexible printed circuit) 1506,which in turn is connected to an external apparatus. The gate-sidedriver circuit shown in FIG. 1 is used in the gate-side driver circuit1504 in FIG. 15(A), while the source-side driver circuit shown in FIG. 3is used in the source-side driver circuit 1503 in FIG. 15(A).Furthermore, the pixel section shown in FIG. 5 is used in the pixelsection 1502 in FIG. 15(A). In this case, a first sealing member 1511, acover member 1512, an adhesive 1513 (see FIG. 15(B)), and a secondsealing member 1514 are formed so as to surround the pixel section 1502,the source-side driver circuit 1503, and the gate-side driver circuit1504.

FIG. 15(B) corresponds to the cross-sectional view obtainable by cuttingFIG. 15(A) along A-A′. In this case, a region surrounded with a dashedline 1500 corresponds to the cross-sectional view shown in FIG. 9(C),and accordingly, any detailed descriptions thereof will be omitted here.

A cathode of the EL element is electrically connected to the wiring 1505in the region denoted by reference numeral 1514. The wiring 1505 isprovided to supply a predetermined voltage to the cathode, and iselectrically connected to the FPC 1506 via an anisotropic conductivefilm 1515. Furthermore, the EL element is surrounded with the firstsealing member 1511 and the cover member 1512 which is bonded to thesubstrate 1501 by the first sealing member 1511. The EL element isencapsulated with an adhesive 1513.

Furthermore, a spacer may be contained in the adhesive 1513. In thiscase, if the spacer is formed of barium oxide, it is possible to allowthe spacer itself to have water-absorbing capability. In the case wherethe spacer is provided, it is advantageous to provide on a cathode, aresin film as a buffer layer for mitigating a pressure from the spacer.

The wiring 1505 is electrically connected to the FPC 1506 via theanisotropic conductive film 1515. The wiring 1505 transmits to the FPC1506 the signal to be sent to the pixel section 1502, the source-sidedriver circuit 1503, and the gate-side driver circuit 1504. The wiring1505 is electrically connected to the external apparatus by the FPC1506.

Furthermore, in the present embodiment, the second sealing member 1514is provided to cover an exposed portion of the first sealing member 1511and a portion of the FPC 1506, so that the EL element can be completelyshut out from the ambient air. The light-emitting device having thecross-sectional structure shown in FIG. 15(B) is thus obtained. Thelight-emitting device in the present embodiment can be freely combinedwith any structures in Embodiments 1 through 6.

Embodiment 8

In the present embodiment, the pixel structure of the light-emittingdevice in accordance with the present invention will be described withreference to FIGS. 16(A) and 16(B). In the present embodiment, referencenumeral 1601 denotes a source wiring of a switching TFT 1602, 1603denotes a gate wiring of the switching TFT 1602. 1604 denotes acurrent-controlling TFT, 1605 denotes a capacitor (that can be omitted),1606 denotes a current supply line, 1607 denotes a power sourcecontrolling TFT. 1608 denotes an EL element, and 1609 denotes a powersource controlling line. In this case, the source wiring 1601, the gatewiring 1603, the current supply line 1606, and the power sourcecontrolling line 1608 are formed of the identical conductive film in thesame layer.

With respect to operations of the power source controlling TFT 1607,reference can be made to Japanese Patent Application No. 11-341272. Itshould be noted that in the present embodiment, the power sourcecontrolling TFT is formed as the p-channel type that has the structureidentical to that of the current-controlling TFT.

Although the power source controlling TFT 1607 is provided between thecurrent-controlling TFT 1604 and the EL element 1608 in the presentembodiment, it is also possible to provide the current-controlling TFT1604 between the power source controlling TFT 1607 and the EL element1608. Furthermore, the power source controlling TFT 1607 is preferablyformed to have the identical structure with the current-controlling TFT1604, or to be connected in series with the current-controlling TFT 1604while utilizing the identical active layer thereto.

FIG. 16(A) illustrates an example in which the current supply line 1606is shared with the two pixels. More specifically, the two pixels areformed to be symmetric to each other with respect to the current supplyline 1606. In this case, the number of the necessary current supplylines can be reduced, and thus the pixel section can be formed withhigher precision. On the other hand, FIG. 16(B) illustrates an examplein which the current supply line 1610 is arranged in parallel to thegate wiring 1603, while the current controlling line 1611 is arranged inparallel to the source wiring 1601.

The structure as described in the present embodiment can be freelycombined with any structures in Embodiments 1 through 7.

Embodiment 9

In the present embodiment, the pixel structure of the light-emittingdevice in accordance with the present invention will be described withreference to FIGS. 17(A) and 17(B). In the present embodiment, referencenumeral 1701 denotes a source wiring of a switching TFT 1702, 1703denotes a gate wiring of the switching TFT 1702, 1704 denotes acurrent-controlling TFT, 1705 denotes a capacitor (that can be omitted),1706 denotes a current supply line, 1707 denotes an erasing TFT, 1708denotes an erasing gate wiring, and 1709 denotes an EL element. In thiscase, the source wiring 1701, the gate wiring 1703, the current supplyline 1706, and the erasing gate wiring 1708 are formed of the identicalconductive film in the same layer.

With respect to operations of the erasing TFT 1707, reference can bemade to Japanese Patent Application No. 11-338786. It should be notedthat in the present embodiment, the power source controlling TFT isformed as the p-channel type that has the structure identical to that ofthe current-controlling TFT. In the above-mentioned Japanese PatentApplication. No. 11-338786, the erasing gate wiring is referred to asthe erasing gate signal line.

A drain of the erasing TFT 1707 is connected to a gate of thecurrent-controlling TFT 1704, so that a gate voltage of thecurrent-controlling TFT 1704 can be forceably changed. It is preferableto form the erasing TFT 1707 as a p-channel TFT that has the samestructure as the switching TFT 1702 so that an OFF current can bereduced.

FIG. 17(A) illustrates an example in which the current supply line 1706is shared between the two pixels. Namely, the two pixels are formed tobe symmetric to each other with respect to the current supply line 1706.In this case, the number of the necessary current supply lines can bereduced, and thus the pixel section can be formed with higher precision.On the other hand, FIG. 17(B) illustrates an example in which thecurrent supply line 1710 is arranged in parallel to the gate wiring1703, while the erasing gate wiring 1711 is arranged in parallel to thesource wiring 1701.

The structure as described in the present embodiment can be freelycombined with any structures in Embodiments 1 through 7.

Embodiment 10

The light-emitting device in accordance with the present invention mayhave a structure in which several TFTs are provided in one pixel.Although Embodiments 8 and 9 have described examples in which the threeTFTs are provided in one pixel, four through six TFTs may be provided.The present invention is not limited to the pixel structure of thelight-emitting device, but can be embodied in other structures.

The structure as described in the present embodiment can be freelycombined with any structures in Embodiments 1 through 7.

Embodiment 11

In the present embodiment, a film formation apparatus to be used forforming the EL layer and the cathode will be described with reference toFIG. 18. Specifically, in FIG. 18, reference numeral 1801 denotes atransportation chamber (A) in which a transportation chamber (A) 1802 isprovided for realizing transportation of a substrate 1803. Thetransportation chamber (A) 1801 includes a reduced-pressure atmosphere,and is blocked from other treatment chambers by means of gates. Thesubstrate is passed from the transportation chamber (A) 1801 to theother treatment chambers by means of a transportation mechanism (A) whenthe corresponding gate is opened.

A cryopump is used to reduce the pressure in the transportation chamber(A) 1801. An exhaust port 1804 is provided on a side surface of thetransportation chamber (A) 1801, and the exhaust pump is disposed belowthe exhaust port 1804. Such a structure realizes an advantage in that amaintenance operation of the exhaust pump can be easily performed.

The respective treatment chambers will be described below. Since thetransportation chamber (A) 1801 is provided with the reduced-pressureatmosphere, all of the treatment chambers that are directly coupledthereto are provided with an exhaust pump (not illustrated). As theexhaust pump, an oil rotary pump, a mechanical booster pump, a turbomolecular pump, or a cryopump can be used.

Reference numeral 1805 denotes a stock chamber in which a substrate isset (mounted). This chamber is also referred to as a load-lock chamber.The stock chamber 1805 is shielded from the transportation chamber (A)1801 by a gate 1800 a, and a carrier (not illustrated) to which thesubstrate 1803 is set is disposed in this chamber 1805. Furthermore, thestock chamber 1805 is provided with the above-mentioned exhaust pump aswell as a purge line for introducing a nitrogen gas or an inert gas withhigh purity to the stock chamber 1805.

In the present embodiment, the substrate 1803 is set onto the carrierwith an element formation surface being faced-down. This is intended tofacilitate the face-down orientation when films are formed by a vapordeposition method later. In the face-down orientation, films are formedon the substrate with the element formation surface of the substratebeing facing downward. This orientation can suppress attachment of duston the element formation surface of the substrate.

Reference numeral 1806 denotes a transportation chamber (B), that iscoupled to the stock chamber 1805 via a gate 1800 b. The transportationchamber (B) 1806 is provided with a transportation mechanism (B) 1807.Reference numeral 1808 denotes a baking chamber (bake chamber), that iscoupled to the transportation chamber (B) 1806 via a gate 1800 c.

The baking chamber 1808 is provided with a mechanism for inverting thesubstrate orientation in the upside-down manner. Namely, the substratethat has been transported in the face-down orientation is once changedinto a face-up orientation in the baking chamber 1808. This is intendedto allow a treatment in the subsequent spin coater chamber 1809 to beperformed in the face-up orientation. After the treatment in the spincoater chamber 1809 is completed, the substrate is returned to thebaking chamber 1808 to be again inverted upside-down into the face-downorientation, and then further returned to the stock chamber 1805.

The spin coater chamber 1809 is coupled to the transportation chamber(B) 1806 via a gate 1800 d. The spin coater chamber 1809 is a filmformation chamber for forming a film containing an EL material byapplying a solution containing the EL material onto the substrate. Inthe spin coater chamber 1809, a high-molecule type (polymer type)organic EL material is mainly formed. In this case, the film formationchamber is always filled with an inert gas such as nitrogen or argon. Inparticular, when a film is formed in the increased-pressure atmosphereat 1 to 5 atoms (preferably 1.5 to 3 atoms), it is possible toeffectively prevent oxygen or water from entering the film formationchamber.

The EL material to be formed includes, not only that to be used as alight-emitting layer, but also that to be used as an electron injectionlayer or an electron transport layer. Any known high-molecule typeorganic EL material can be also used. Typical organic EL materials forserving as the light-emitting layer include PPV (polyparaphenylenevinylene) derivative, PVK (polyvinyl carbazole) derivative orpolyfluorene derivative. These materials are also referred to asπ-conjugated polymer. Furthermore, as the electron injection layer,PEDOT (polythiophene) or PAni (polyaniline) can be used.

Reference numeral 1810 denotes a treatment chamber for performing asurface treatment to an anode or a cathode to serve as the pixelelectrode of the EL element (hereinafter, this chamber is referred to asthe pre-treatment chamber). The pre-treatment chamber 1810 is shieldedfrom the transportation chamber (A) 1801 by a gate 1800 e. Thepre-treatment chamber can be modified in various manners based on thefabrication process of the EL element to be conducted. In the presentembodiment, the pre-treatment chamber 1810 is configured to heat thepixel electrode at 100 to 120 C while irradiating the surface thereofwith UV-light. Such a pre-treatment is effective when the anode surfaceof the EL element is to be processed.

Reference numeral 1811 denotes a vapor deposition chamber for formingthe conductive film or the EL material by a vapor deposition method. Thevapor deposition chamber 1811 is coupled to the transportation chamber(A) 1801 via a gate 1800 f. The vapor deposition chamber 1811 can beprovided therein with a plurality of vapor deposition sources. Inaddition, it is also possible to cause the vapor deposition sources tobe evaporated by resistive-heating or electron beams to form theintended film.

The conductive film to be formed in the vapor deposition chamber 1811 isprovided as an electrode on the cathode side of the EL element. For thispurpose, a metal having a relatively small work function, typically anelement belonging to Group 1 or Group 2 in the periodic table(typically, lithium, magnesium, cesium, calcium, potassium, barium,sodium, or beryllium), or a metal having a work function which is closeto those thereof can be deposited. Alternatively, aluminum, copper, orsilver can be deposited to form a low-resistance conductive film.Furthermore, a conductive film made of a compound of indium oxide andtin oxide, or a conductive film made of a compound of indium oxide andzinc oxide, can be formed by the vapor deposition method as atransparent conductive film.

In the vapor deposition chamber 1811, any known EL materials (inparticular, low-molecule type organic EL materials) can be formed.Typical examples for the light-emitting layer include Alg₃(tris-8-quinolinolato aluminum complex) or DSA (distyl allylenederivative), while typical examples for the charge injection layerinclude CuPc (copper phthalocyanine), LiF (lithium fluoride), or acacK(potassium acetylacetonate). Furthermore, typical examples for thecharge transport layer include TPD (triphenylamine derivative) or NPD(anthracene derivative).

In addition, it is also possible to perform co-vapor deposition of theabove-mentioned EL material and a fluorescent material (typically,coumarine 6, rubrene, Nile red, DCM, quinacridon, or the like). As thefluorescent material, any known materials may be used. Moreover, it isalso possible to perform co-vapor deposition of the EL material and anelement belonging to Group 1 or Group 2 in the periodic table, so that aportion of the light-emitting layer can exhibit a function as the chargetransport layer or the charge injection layer. The term co-vapordeposition refers to a vapor deposition method in which a plurality ofvapor deposition sources are simultaneously heated to mix differentmaterials with each other during the film formation stage.

In either case, the vapor deposition chamber 1811 is shielded from thetransportation chamber (A) 1801 by means of the gate 1800 f, and thefilm formation of the EL material or the conductive film can beperformed in vacuum. The film formation is performed with the face-downorientation.

Reference numeral 1812 denotes an encapsulation chamber (also referredto as the sealing chamber or the grove box), that is coupled to thetransportation chamber (A) 1801 via a gate 1800 g. In the encapsulationchamber 1812, a process for finally sealing the EL element into a closedspace is performed. This process is intended to provide the formed ELelement with protection against oxygen or water. For this purpose, theEL element is mechanically sealed by means of the cover member.Alternatively, it is also possible to seal the EL element by means of athermosetting resin or a UV-curable resin.

The cover member is adhered to the substrate with the EL element formedthereon by means of the thermosetting resin or the UV-curable resin. Theresin is cured through a heat treatment or a UV irradiation process toform a closed space.

In the film formation apparatus shown in FIG. 18, a mechanism 1813 forUV irradiation is provided within the encapsulation chamber 1812 (such amechanism is referred to as the UV irradiation mechanism 1813hereinafter). Thus, the UV curable resin is allowed to be cured by UVlight emitted from this UV irradiation mechanism 1813. The innerpressure of the encapsulation chamber 1812 may be reduced by providingan exhaust pump, or increased while purging the inner space with anitrogen gas or an inert gas having high purity.

A receiving chamber (path box) 1814 is coupled to the encapsulationchamber 1812. The receiving chamber 1814 is provided with atransportation mechanism (C) 1815 for transporting to the receivingchamber 1814 the substrate for which the encapsulation of the EL elementis completed in the encapsulation chamber 1812. The inner pressure ofthe receiving chamber 1814 can be also reduced by providing an exhaustpump. The receiving chamber 1814 is intended to prevent theencapsulation chamber 1812 from being directly exposed to the ambientair, and the substrate is taken out from the receiving chamber 1814.

As described in the above, the film formation apparatus shown in FIG. 18allows the EL element to be completely sealed into a closed spacewithout being exposed to the ambient air, and accordingly, realizesfabrication of a light-emitting device having a high reliability.

Embodiment 12

The gate-side driving circuit as shown in FIG. 1 and the source-sidedriving circuit as shown in FIG. 3 can be applied, not only to thelight-emitting device, but also to the liquid crystal display device. Anexternal appearance of the liquid crystal display device in accordancewith the present invention is illustrated in FIG. 19(A), while FIG.19(B) illustrates the cross-sectional structure of its pixel section.

In FIG. 19(A), a pixel section 1901, a gate-side driver circuit 1902 anda source-side driver circuit 1903 are formed on a substrate 1900. Inthis case, the pixel section as shown in FIG. 5 is used as the pixelsection 1901. Moreover, the gate-side driving circuit shown in FIG. 1 isused as the gate-side driver circuit 1902, while the source-side drivingcircuit shown in FIG. 3 is used as the source-side driver circuit 1903.

A gate wiring 1904 and a source wiring 1905 extend from the gate-sidedriver circuit 1902 and the source-side driver circuit 1903,respectively, and a pixel TFT 1906 is formed at the crossing point ofthe gate wiring 1904 and the source wiring 1905. To the pixel TFT 1906,a retaining capacitance 1907 and a liquid crystal element 1908 areconnected in parallel. Furthermore, connecting wirings 1910 and 1911 areformed to extend from an FPC 1909 to input terminals of the drivercircuits. Reference numeral 1912 denotes a counter substrate.

In the pixel structure as shown in FIG. 19(B), the p-channel TFT 1913forming the driver circuit and the p-channel TFT 1914 serving as theswitching element may be fabricated in accordance with Embodiment 2described previously. It should be noted that reference numeral 1915denotes an orientation film, 1916 denotes a counter substrate, 1917denotes a light shielding film, 1918 denotes a counter electrode, 1919denotes an orientation film, 1920 denotes a sealing member, 1921 denotesa spacer made of a resin, and 1922 denotes liquid crystal. Thesecomponents may be formed by any known method. Furthermore, the structureof the liquid crystal element is not limited to that described in thepresent embodiment.

Embodiment 13

Although the examples in which the pixel section and the driver circuitare formed of p-channel TFTs have been described in Embodiments 1through 10 and 12, it is also possible to form the pixel section and thedriver, only of n-channel TFTs. In this case, the driver circuits arerequired to be slightly modified such that, for example, the polaritiesof the power source lines are inverted in the driver circuits.

In such a case, the anode and the cathode are replaced with each other,so that the structure of the EL element is reversed. In other words, itis preferable to realize a structure in which the cathode is connectedto a drain of the current-controlling TFT. It should be noted that inEmbodiments 8 to 10, all TFTs other than the switching TFT and thecurrent-controlling TFT, if they exist in the pixel, are formed as then-channel TFT.

Embodiment 14

In the light-emitting device as described in Embodiment 1, it ispreferable to provide a silicon nitride film or a silicon oxynitridefilm as the underlying film 502, and to cover the switching TFT 601 andthe current-controlling 602 with the passivation film 517 including asilicon nitride film or a silicon oxynitride film.

In such a structure, the switching TFT 601 and the current-controllingTFT 602 are sandwiched between the silicon nitride film or the siliconoxynitride film. Thus, water or movable ions can be effectivelyprevented from entering into the device from the external atmosphere.

Moreover, it is preferable to provide a silicon nitride film or a DLC(diamond-like carbon) film between the pixel electrode 523 and aplanarization film 518 made of an organic resin formed on thepassivation film 517, and further provide the aforementioned siliconnitride film or DLC film on the cathode.

In such a structure, the EL element is sandwiched between the siliconnitride films or the DLC films. Thus, not only water or movable ionsfrom the external atmosphere but also oxygen can be effectivelyprevented from entering into the device. Although the organic materialsto be used in the light-emitting layer or the like in the EL element areotherwise likely to be easily oxidized thereby resulting indeterioration, the structure in the present embodiment can allow thereliability of the device to be significantly improved.

As described in the above, reliability of the entire light-emittingdevice can be improved by providing a measure for protecting the TFTs aswell as a measure for protecting the EL element.

The structure as described in the present embodiment can be freelycombined with any structures in Embodiments 1 through 10.

Embodiment 15

The display device formed by implementing the present invention can beused as a display portion of various kinds of electric equipments. Forinstance, when appreciating a television broadcast or the like, adisplay incorporating a 20 to 60 inch diagonal display device of thepresent invention in a casing may be used. Note that a personal computerdisplay, a television broadcast receiving display, and a display forexhibiting all information such as a display for displayingannouncements are included in the displays having the display deviceincorporated in a casing.

The following can be given as other electronic equipments of the presentinvention: a video camera; a digital camera; a goggle type display (headmounted display); a navigation system; an audio playback device (such asa car audio stereo or an audio component stereo); a notebook typepersonal computer; a game apparatus; a portable information terminal(such as a mobile computer, a portable telephone, a portable gamemachine, or an electronic book); and an image playback device equippedwith a recording medium (specifically, device provided with a displayportion which plays back images in a recording medium and displays theimages). Specific examples of these electronic equipments are shown inFIGS. 20 and 21.

FIG. 20A shows a display having a display device incorporated in acasing, and the display contains a casing 2001, a support stand 2002, adisplay portion 2003 and the like. The display device of the presentinvention can be used as the display portion 2003.

FIG. 20B shows a video camera, and contains a main body 2101, a displayportion 2102, a sound input portion 2103, operation switches 2104, abattery 2105, an image receiving portion 2106 and the like. The displaydevice of the present invention can be used as the display portion 2102.

FIG. 20C is a portion (right side) of a head mounted EL display, andcontains a main body 2201, a signal cable 2202, a head fixing band 2203,a display portion 2204, an optical system 2205, a light-emitting device2206 and the like. The present invention can be applied to theself-emitting device 2206.

FIG. 20D is an image playback device equipped with a recording medium(specifically, a DVD playback device), and contains a main body 2301, arecording medium (such as a DVD) 2302, operation switches 2303, adisplay portion (a) 2304, a display portion (b) 2305 and the like. Thedisplay portion (a) 2304 is mainly used for displaying imageinformation. The display portion (b) 2305 is mainly used for displayingcharacter information. The display device of the present invention canbe used as the display portion (a) 2304 and as the display portion (b)2305. Note that the image playback device equipped with the recordingmedium includes devices such as household game machines.

FIG. 20E shows a portable (mobile) computer, and contains a main body2401, a camera portion 2402, an image receiving portion 2403, operationswitches 2404, a display portion 2405 and the like. The display deviceof the present invention can be used as the display portion 2405.

FIG. 20F is a personal computer, and contains a main body 2501, a casing2502, a display portion 2503, a keyboard 2504 and the like. The displaydevice of the present invention can be used as the display portion 2503.

FIG. 21A shows a rear type projector (projection TV) comprising a mainbody 2601, an optical source 2602, a liquid crystal display device 2603,a polarization beam splitter 2604, reflectors 2605 and 2606 and a screen2607. The present invention is applicable to the liquid crystal displaydevice 2603.

FIG. 21B shows a front type projector comprising a main body 2701, anoptical source 2702, a liquid crystal display device 2703, an opticalsystem 2704 and a screen 2705. The present invention is applicable tothe liquid crystal display device 2703.

Note that, if the luminance further increases in the future, althoughnot shown, then it will become possible to use the light-emitting deviceof the present invention in a front type or a rear type projector byexpanding and projecting light containing output image information witha lens, an optical fiber or the like.

In addition, since the light-emitting device conserves power in thelight-emitting portion, it is preferable to display information so as tomake the light-emitting portion as small as possible. Consequently, whenusing the light-emitting device in a display portion mainly forcharacter information, such as in a portable information terminal, inparticular a portable telephone or an audio playback device, it ispreferable to drive the light-emitting device so as to form characterinformation by the light-emitting portions while non-light-emittingportions are set as background.

FIG. 21C shows a portable telephone, and contains a main body 2801, asound output portion 2802, a sound input portion 2803, a display portion2804, operation switches 2805, and an antenna 2806. The light-emittingdevice of the present invention can be used as the display portion 2804.Note that by displaying white color characters in a black colorbackground, the display portion 2804 can suppress the power consumptionof the portable telephone. Of course, it is possible to also use theliquid crystal display device of the present invention for the displayportion 2804.

FIG. 21D shows an audio playback device, specifically a car audiostereo, and contains a main body 2901, a display portion 2902, andoperation switches 2903 and 2904. The light-emitting device of thepresent invention can be used as the display portion 2902. Further, acar audio stereo is shown in this embodiment, but a portable type or ahousehold audio playback device may also be used. Note that bydisplaying white color characters in a black color background, thedisplay portion 2904 can suppress the power consumption. This isespecially effective in a portable type audio playback device. Ofcourse, it is possible to also use the liquid crystal display device ofthe present invention for the display portion 2804.

Thus, the application range of the present invention is extremely wide,whereby it may be employed in electric equipments of all fields.Further, the electric equipments of this embodiment may employ thelight-emitting device having any of the constitutions of Embodiments 1through 14.

Thus, in accordance with the present invention, the display device canbe fabricated with very small number of fabrication steps. Accordingly.a fabrication yield can be increased, while a fabrication cost can bereduced, thereby resulting in an inexpensive display device beingfabricated.

Furthermore, since an inexpensive display device can be provided,various electrical apparatuses which employ the display device in theirdisplay section can be provided at a low price.

What is claimed is:
 1. (canceled)
 2. A light-emitting device comprising:a plastic substrate; a first adhesive over the plastic substrate; aninsulating film comprising silicon and nitrogen; a cathode of an ELelement over the insulating film; and a second adhesive over the cathodeof the EL element.
 3. The light-emitting device according to claim 2,further comprising a pixel, wherein the pixel comprises a firsttransistor and a second transistor and the EL element, wherein one of asource and a drain of the first transistor is electrically connected tothe EL element, wherein the other of the source and the drain of thefirst transistor is electrically connected to a current supply line,wherein one of a source and a drain of the second transistor iselectrically connected to a gate of the first transistor, wherein a gateof the second transistor is electrically connected to a gate wiring, andwherein the current supply line is parallel to the gate wiring.
 4. Thelight-emitting device according to claim 3, wherein the other of thesource and the drain of the second transistor is electrically connectedto a source wiring.
 5. The light-emitting device according to claim 2,further comprising a first pixel and a second pixel, wherein the firstpixel comprises a first transistor and the EL element, wherein thesecond pixel comprises a second transistor, wherein one of a source anda drain of the first transistor is electrically connected to the ELelement, wherein the other of the source and the drain of the firsttransistor is directly connected to a current supply line, and whereinone of a source and a drain of the second transistor is directlyconnected to the current supply line.
 6. The light-emitting deviceaccording to claim 2, further comprising a pixel, wherein the pixelcomprises a first transistor and a second transistor and the EL element,wherein one of a source and a drain of the first transistor iselectrically connected to the EL element, wherein the other of thesource and the drain of the first transistor is electrically connectedto one of a source and a drain of the second transistor, and wherein theother of the source and the drain of the second transistor iselectrically connected to a current supply line.
 7. The light-emittingdevice according to claim 6, wherein the other of the source and thedrain of the second transistor is directly connected to the currentsupply line.
 8. A light-emitting device comprising: a plastic substrate;a first adhesive over the plastic substrate; an insulating filmcomprising silicon and nitrogen; a cathode of an EL element over theinsulating film; a second adhesive over the cathode of the EL element;and a cover member over the second adhesive.
 9. The light-emittingdevice according to claim 8, further comprising a pixel, wherein thepixel comprises a first transistor and a second transistor and the ELelement, wherein one of a source and a drain of the first transistor iselectrically connected to the EL element, wherein the other of thesource and the drain of the first transistor is electrically connectedto a current supply line, wherein one of a source and a drain of thesecond transistor is electrically connected to a gate of the firsttransistor, wherein a gate of the second transistor is electricallyconnected to a gate wiring, and wherein the current supply line isparallel to the gate wiring.
 10. The light-emitting device according toclaim 9, wherein the other of the source and the drain of the secondtransistor is electrically connected to a source wiring.
 11. Thelight-emitting device according to claim 8, further comprising a firstpixel and a second pixel, wherein the first pixel comprises a firsttransistor and the EL element, wherein the second pixel comprises asecond transistor, wherein one of a source and a drain of the firsttransistor is electrically connected to the EL element, wherein theother of the source and the drain of the first transistor is directlyconnected to a current supply line, and wherein one of a source and adrain of the second transistor is directly connected to the currentsupply line.
 12. The light-emitting device according to claim 8, furthercomprising a pixel, wherein the pixel comprises a first transistor and asecond transistor and the EL element, wherein one of a source and adrain of the first transistor is electrically connected to the ELelement, wherein the other of the source and the drain of the firsttransistor is electrically connected to one of a source and a drain ofthe second transistor, and wherein the other of the source and the drainof the second transistor is electrically connected to a current supplyline.
 13. The light-emitting device according to claim 12, wherein theother of the source and the drain of the second transistor is directlyconnected to the current supply line.
 14. A light-emitting devicecomprising: a substrate; a first adhesive over the substrate; aninsulating film comprising silicon and nitrogen; a cathode of an ELelement over the insulating film; a second adhesive over the cathode ofthe EL element; and a cover member over the second adhesive, whereineach of the substrate and the cover member is a PET film.
 15. Thelight-emitting device according to claim 14, further comprising a pixel,wherein the pixel comprises a first transistor and a second transistorand the EL element, wherein one of a source and a drain of the firsttransistor is electrically connected to the EL element, wherein theother of the source and the drain of the first transistor iselectrically connected to a current supply line, wherein one of a sourceand a drain of the second transistor is electrically connected to a gateof the first transistor, wherein a gate of the second transistor iselectrically connected to a gate wiring, and wherein the current supplyline is parallel to the gate wiring.
 16. The light-emitting deviceaccording to claim 15, wherein the other of the source and the drain ofthe second transistor is electrically connected to a source wiring. 17.The light-emitting device according to claim 14, further comprising afirst pixel and a second pixel, wherein the first pixel comprises afirst transistor and the EL element, wherein the second pixel comprisesa second transistor, wherein one of a source and a drain of the firsttransistor is electrically connected to the EL element, wherein theother of the source and the drain of the first transistor is directlyconnected to a current supply line, and wherein one of a source and adrain of the second transistor is directly connected to the currentsupply line.
 18. The light-emitting device according to claim 14,further comprising a pixel, wherein the pixel comprises a firsttransistor and a second transistor and the EL element, wherein one of asource and a drain of the first transistor is electrically connected tothe EL element, wherein the other of the source and the drain of thefirst transistor is electrically connected to one of a source and adrain of the second transistor, and wherein the other of the source andthe drain of the second transistor is electrically connected to acurrent supply line.
 19. The light-emitting device according to claim18, wherein the other of the source and the drain of the secondtransistor is directly connected to the current supply line.